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US 9,318,157 B2Granted
Stacked device detection and identification
AssigneeMicron Technology, Inc.
InventorsYutaka Ito, Keiichiro Abe
Life of this patent
Estimating the term…
Abstract
Various embodiments include apparatus and methods having circuitry to detect and/or assign identification information to dice arranged in a stack and coupled by conductive paths.
Claims19
An apparatus comprising:
- a stack of dice comprising a first die having a control circuit and a monitor circuit, and a second die having an identification (ID) circuit, wherein the ID circuit of the second die is configured to determine ID information associated with the second die, and wherein the control circuit of the first die is configured to detect the second die by comparing a monitored current at the monitor circuit of the first die with a reference current determined by a resistance of the ID circuit of the second die.
An apparatus comprising:
- a plurality of conductive paths to couple dice in a stack, wherein a first die of the dice comprises an ID circuit to assign identification information to the first die during an initialization time period;
- and
- a control circuit in the first die of the dice to detect a second die of the dice by comparing a monitored current at a monitor circuit of the first die with a reference current determined by a resistance of an ID circuit of the second die.
An apparatus, comprising:
- a plurality of dice in a stack, wherein a first die in the stack comprises a control circuit to detect others of the dice in the stack, and wherein a second die in the stack comprises an ID circuit, wherein the control circuit of the first die is configured to detect the second die of the other dice by comparing a monitored current at a monitor circuit of the first die with a reference current determined by a resistance of the ID circuit of the second die;
- and
- a plurality of conductive paths, wherein a first conductive path and a second conductive path in the plurality of conductive paths are to connect the first die and the second die in the stack, and wherein the ID circuit of the second die is coupled between the first conductive path and the second conductive path.
Dependencies are inferred from the claim text.