RFID tag assembly methods
AssigneeImpinj, Inc.
InventorsRonald L. Koepp, Ronald A. Oliver, William T. Colleran, Yanjun Ma, Jay M. Fassett, Vincent C. Moretti
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Abstract
RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.
Claims6
A Radio Frequency Identification (RFID) integrated circuit (IC) assembly, the IC assembly comprising:
- an integrated circuit (IC) comprising:
- a rectifier circuit;
- a demodulator circuit;
- a modulator circuit;
- and
- a first electrical bus coupled to the rectifier circuit, the demodulator circuit, and
- the modulator circuit;
- a dielectric material including a covering layer of the IC assembly;
- and
- a plurality of distinct conductive patches for coupling electrical circuitry of the IC to a tag antenna through the dielectric material, wherein:
- the plurality of conductive patches covers a substantial portion of a surface of the IC;
- and
- at least a first one of the conductive patches is capacitively coupled to the first electrical bus.
Dependencies are inferred from the claim text.