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US 9,316,907 B2Granted
Photosensitive resin composition and uses thereof
AssigneeChi Mei Corporation
InventorYu-Jie Tsai
Life of this patent
Estimating the term…
Abstract
The invention relates to a photosensitive resin composition that has good heat resistance and good humidity resistance. The invention also provides a method for forming a thin film on a substrate, a thin film on a substrate and an apparatus.
Claims20
A photosensitive resin composition comprising:
- an alkali-soluble resin (A);
- a compound having an ethylenically unsaturated group (B);
- a photoinitiator (C);
- and
- a solvent (D);
- wherein said compound having an ethylenically unsaturated group (B) comprises a dioxane unsaturated compound (B-1) and an isocyanurate unsaturated compound (B-2) represented by Formula (2), and a ratio of the used amount by weight of the dioxane unsaturated compound (B-1)/isocyanurate unsaturated compound (B-2) is from 0.05 to 15;
- and
- the dioxane unsaturated compound (B-1) comprises a dioxane unsaturated compound having an 1,3-dioxane frame represented by Formula (1-1) and/or a dioxane unsaturated compound having an 1,3-dioxolane frame represented by Formula (1-2):
- wherein:
- in Formula (1-1), R1 to R8 independently represent a hydrogen atom or a hydrocarbon group, and at least one of R1 to R8 has an ethylenically unsaturated group as a substituent at its end portion;
- in Formula (1-2), R1 to R6 independently represent a hydrogen atom or a hydrocarbon group, and at least one of R1 to R6 has an ethylenically unsaturated group as a substituent at its end portion;
- wherein:
- X1, X2 and X3 independently represent a hydrogen atom, (meth)acryloyl group or a hydrocarbon group having 1 to 20 carbon atoms;
- and at least two of X1, X2 and X3 represent a (meth)acryloyl group;
- and
- R9, R10 and R11 independently represent an oxyalkylene group.
13 more elements
Dependencies are inferred from the claim text.