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US 9,316,901 B2Granted
Method for forming patterns
AssigneeUnited Microelectronics Corp.
InventorsHsin-Yu Chen, Chia-Wei Huang, Chun-Hsien Huang, Shih-Chun Tsai, Kai-Lin Chuang
Life of this patent
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Abstract
A method for forming patterns includes the following steps. A first layout including a first target pattern and a first unprintable dummy pattern is provided. A second layout including a second target pattern and a second printable dummy pattern are provided, wherein at least part of the second printable dummy pattern overlaps the first unprintable dummy pattern exposure limit, such that the second printable dummy pattern cannot be formed in a wafer.
Claims19
A method for forming patterns, comprising:
- providing a first layout comprising a first target pattern and a first unprintable dummy pattern, wherein the dimension of the first unprintable dummy pattern is smaller than the exposure limit;
- and
- providing a second layout comprising a second target pattern and a second printable dummy pattern, wherein the dimension of at least part of the second printable dummy pattern which overlaps the first unprintable dummy pattern is larger than the exposure limit, such that the second printable dummy pattern cannot be formed in a wafer.
Dependencies are inferred from the claim text.