Micro electro-mechanical heater

A sub-micron scale property testing apparatus comprising:

• a test subject holder and heating assembly, the test subject holder and heating assembly includes:
• a holder base configured to couple with a sub-micron scale property testing instrument and electro-mechanical transducer assembly;
• and
• a sample stage extending from with the holder base, the holder base supporting the sample stage thereon, the sample stage includes:
• a base interface coupled with the holder base,
• a test subject stage coupled with the base interface, the base interface interposed between the test subject stage and the holder base, and the test subject stage is thermally isolated from the holder base, the test subject stage includes:
• a stage subject surface configured to receive a test subject,
• a stage plate bracing the stage subject surface, the stage plate is under the stage subject surface and extends across the stage subject surface,
• wherein, when the sample stage is installed in a transmission electron microscope the stage subject surface positions the test subject within a transmission electron beam, the stage subject surface and the stage plate are both offset from the electron beam and the stage subject surface intercepts a testing instrument axis of the sub-micron scale property testing instrument, and
• a heating element on the test subject stage and adjacent to the stage subject surface and the stage plate, the heating element is configured to generate heat at the stage subject surface, and
• at least one support extending from the base interface to the stage subject surface and the heating element, the at least one support has a cross sectional area perpendicular to a direction from the base interface to the stage subject surface smaller or equal to a cross sectional area of the test subject stage perpendicular to the same direction.

A sub-micron scale property testing apparatus comprising:

• a test subject holder and heating assembly, the test subject holder and heating assembly includes:
• a holder base configured to couple with a sub-micron mechanical testing instrument and electro-mechanical transducer assembly,
• a test subject stage extending from the holder base, the test subject stage includes a stage plate, the test subject stage is configured to receive a test subject on a stage subject surface coupled with the stage plate, when installed within a transmission electron microscope the test subject stage is outside of an electron beam of the transmission electron microscope and the test subject stage statically positions a test subject location of a test subject both within the electron beam and along a testing instrument axis of the sub-micron mechanical property testing instrument while the stage subject surface is both offset from the electron beam and intercepts the testing instrument axis, and the test subject stage is thermally isolated from the holder base, and
• a heating element on the test subject stage and interposed between the stage subject surface and the stage plate, wherein the heating element is configured to generate heat at the stage subject surface.

A sub-micron scale property testing apparatus comprising:

• a test subject holder and heating assembly configured to couple with a transmission electron microscope and a sub-micron mechanical property testing instrument having a testing instrument axis, the test subject holder and heating assembly includes:
• a holder base configured for coupling with the transmission electron microscope and the sub-micron mechanical property testing instrument,
• a sample stage extending from the holder base, the holder base supporting the sample stage thereon, the sample stage includes:
• a base interface coupled with the holder base,
• a means for holding a test subject coupled with the base interface, the base interface interposed between the holder base and the means for holding, the means for holding includes a subject surface configured to receive a subject, the means for holding the test subject is both outside of an electron beam of a transmission electron microscope when the test subject holder is installed in the transmission electron microscope and intercepts the testing instrument axis, and the means for holding the test subject positions the test subject within the electron beam, the means for holding includes a plate beneath the subject surface,
• a means for heating both a test subject and the subject surface, the means for heating is interposed between the subject surface and the plate, and the means for heating generates heat at the means for holding, and
• at least one support extending from the base interface to the means for holding and the means for heating, the at least one support having a cross sectional area smaller than or equal to a cross sectional area of the means for holding, the at least one support thermally isolating the means for holding from the holder base.

A method of sub-micron scale mechanical testing of a test subject, the method comprising:

• coupling a test subject along a stage subject surface of a test subject stage, the test subject stage extending from a holder base;
• coupling the holder base within a sub-micron scale mechanical testing instrument and electro-mechanical transducer assembly, at least the test subject stage is outside of an electron beam axis when the electro-mechanical transducer assembly is installed in a transmission electron microscope;
• heating the test subject to a specified temperature through heat generated at the test subject stage adjacent to the test subject by a heating element;
• mechanically testing the test subject at a test subject location on a micrometer or less scale;
• bracing the stage subject surface against deflection from mechanically testing with a stage plate extending across the stage subject surface;
• and
• holding the test subject statically against thermal mechanical drift and expansion from the heating by throttling heat transfer from the test subject stage to the holder base, holding includes:
• statically positioning the test subject location within the electron beam with the test subject stage while the test subject stage is offset from the electron beam, and
• at the same time statically positioning the test subject location along a testing instrument axis of the sub-micron scale mechanical testing instrument while the test subject stage intercepts the testing instrument axis.