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US 9,315,699 B2Granted
Photocurable adhesive composition
AssigneeLG Hausys, Ltd.
InventorsSang Hwan Kim, Yong Hoon Lee, Dai Hyun Kim, Won Gu Choi, Jang Soon Kim
Life of this patent
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Abstract
Provided is an adhesive composition comprising: a thermosetting epoxy resin formed with an epoxy copolymer containing a hydroxyl group; and a UV curable epoxy resin having an epoxy equivalence of 100 g/eq to 500 g/eq.
Claims11
An adhesive composition comprising:
- a thermally curable epoxy resin formed of a hydroxyl group-containing epoxy copolymer;
- and a UV curable epoxy resin having an epoxy equivalent weight of 100 g/eq to 500 g/eq, wherein
- the epoxy copolymer has a weight average molecular weight of 20,000 to 70,000;
- and
- the thermally curable epoxy resin has a hydroxyl group equivalent weight of 200 g/eq to 400 g/eq.
2 more elements
Dependencies are inferred from the claim text.