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US 9,315,696 B2Granted
Ephemeral bonding
AssigneesDow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
InventorsZhifeng Bai, Mark S. Oliver, Michael K. Gallagher, Christopher J. Tucker, Karen R. Brantl, Elissei Iagodkine, Zidong Wang
Life of this patent
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Abstract
Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.
Claims14
A method of releasably attaching a semiconductor wafer to a carrier substrate comprising:
- (a) providing a semiconductor wafer having a front side and a back side;
- (b) providing a carrier substrate having an attachment surface;
- (c) disposing a temporary bonding composition comprising a curable adhesive material, a release additive and a compatibilizer between the front side of the semiconductor wafer and the attachment surface of the carrier substrate;
- and
- (d) curing the adhesive material to provide a temporary bonding layer disposed between the front side of the semiconductor wafer and the attachment surface of the carrier substrate;
- wherein the temporary bonding layer adjacent to the attachment surface of the carrier substrate comprises a relatively lower amount of the release additive and the temporary bonding layer adjacent to the front side of the semiconductor wafer comprises a relatively higher amount of the release additive;
- wherein the release additive is a polyether compound;
- and wherein the release additive is free of silicon.
5 more elements
Dependencies are inferred from the claim text.