Base material film for dicing sheet and dicing sheet

A semiconductor wafer dicing sheet base material film having a surface configured to contact and to be laminated to a pressure-sensitive adhesive layer, the dicing sheet base material film comprising:

• a single layer of resin film or multiple layers of resin films, wherein
• at least the resin film configured to contact and be laminated to the pressure-sensitive adhesive layer is formed from a resin composition having a cross-linked structure and containing ethylene-(meth)acrylic acid copolymer as a main constituent and 0.3 to 17.0 parts by mass of an epoxy compound as a crosslinking agent based on 100 parts by mass of the ethylene-(meth)acrylic acid copolymer,
• the ethylene-(meth)acrylic acid copolymer excludes ethylene-ionomer copolymer,
• the number average molecular weight of the epoxy compound is 250 or more and 5,000 or less, and
• the semiconductor wafer dicing sheet base material film is configured to reduce generation of dust when attached to a semiconductor wafer during blade dicing of the semiconductor wafer.