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AssigneeDow Global Technologies LLC
InventorsJeffery L. Reynolds, Rajesh H. Turakhia, George C. Jacob, Marty J. Null
Estimating the term…
A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.
A curable composition comprising an epoxy resin mixture, wherein the epoxy resin mixture comprises 70 weight percent to 100 weight percent of cycloaliphatic epoxy resins based on a total weight of the epoxy resin mixture;
Dependencies are inferred from the claim text.
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Compositions of epoxy resins
Di-epoxy compounds: mixtures of di-epoxy compounds
Di-epoxy compounds: carbocyclic
Epoxy compounds containing three or more epoxy groups: carbocyclic compounds
About 3 years 9 months of term left · ends 1 Aug 2030 (estimated)
1. Field of the Disclosure
Embodiments disclosed herein relate generally to curable compositions and thermoset resins formed from such curable compositions. The curable compositions, for example, may include an admixture of cycloaliphatic epoxy resins or an admixture of a) a cycloaliphatic epoxy resin; b) one or more of a flexibilized cycloaliphatic resin, an epoxy phenolic novolac resin, an epoxy bisphenol A novolac resin, a multifunctional epoxy resin, a bisphenol-A or bisphenol F based epoxy resin, and a polyether polyol c) a catalyst; and d) one or more cycloaliphatic anhydride hardeners. Hardeners used in the curable compositions may include cycloaliphatic anhydrides.
2. Background
In one aspect, embodiments disclosed herein relate to curable compositions and thermoset resins formed from such curable compositions. The curable compositions, for example, may include an admixture of cycloaliphatic epoxy resins. Hardeners used in the curable compositions may include, for examples, cycloaliphatic anhydrides. In a family of embodiments, curable compositions disclosed herein may include an admixture of a) a cycloaliphatic epoxy resin; b) one or more of a flexibilized cycloaliphatic resin, an epoxy phenolic novolac resin, an epoxy bisphenol A novolac resin, a multifunctional epoxy resin, a bisphenol-A or bisphenol F based epoxy resin, and a polyether polyol c) a catalyst; and d) one or more cycloaliphatic anhydride hardeners.
Such compositions may exhibit low viscosities and high reactivity, suitable for use in composites and coating applications. Upon cure, such as a thermal cure, the resulting thermoset resins may have a good balance of physical properties, including a high glass transition temperature, a high tensile strength, a high tensile modulus, and a high elongation at break.
Curable compositions described herein, formed from an admixture of cycloaliphatic epoxy resins or an admixture of a) a cycloaliphatic epoxy resin; b) one or more of a flexibilized cycloaliphatic resin, an epoxy phenolic novolac resin, an epoxy bisphenol A novolac resin, a multifunctional epoxy resin, a bisphenol-A or bisphenol F based epoxy resin, and a polyether polyol, c) a catalyst; and d) one or more cycloaliphatic anhydride hardeners, may have a viscosity less than about 10000 mPa-s (ASTM D-445 at 25° C.), in some embodiments. In other embodiments, curable compositions disclosed herein may have a viscosity of less than about 7500 mPa-s; less than about 5000 mPa-s in other embodiments; less than about 2500 mPa-s in other embodiments; less than about 1750 mPa-s in other embodiments; and less than about 1000 mPa-s in yet other embodiments.