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US 9,315,655 B2Granted
Fiber reinforced resin molding compound and manufacturing method for fiber reinforced resin molded article therefrom
AssigneeOCV Intellectual Capital, LLC
InventorMitsuru Akagawa
Life of this patent
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Abstract
A molding compound for manufacturing a fiber reinforced molded article is provided. The molding compound includes a resin composition and reinforcing fibers, with the resin composition containing an unsaturated polyester resin, a microencapsulated curing agent and a non-microencapsulated curing agent.
Claims7
A molding compound comprising a resin composition and reinforcing fibers, wherein the resin composition contains an unsaturated polyester resin, a microencapsulated curing agent and a non-microencapsulated curing agent,
- wherein the non-microencapsulated curing agent has a longer curing time compared with the microencapsulated curing agent,
- wherein the microencapsulated curing agent contains an organic peroxide having a one minute half-life temperature of 115° C. to 130° C.;
- and wherein the non-microencapsulated curing agent contains an organic peroxide having a one minute half-life temperature of 140° C. to 170° C.
Dependencies are inferred from the claim text.