Photocurable composition and encapsulated apparatus prepared using the same

Abstract

A photocurable composition, a composition for encapsulation of an organic light emitting diode, and an encapsulated apparatus, wherein, in the photocurable composition, when A represents a glass-metal alloy die shear strength in kgf between a glass substrate and a Ni/Fe alloy after curing, and B represents curing shrinkage in % as determined by Equation 1, below, and the photocurable composition has a value for A/B of about 0.7 kgf/% or more and the glass-metal alloy die shear strength of about 2.5 kgf or more, Curing shrinkage=|(Specific gravity of solid photocurable composition after curing)−(Specific gravity of liquid photocurable composition before curing)|/(Specific gravity of liquid photocurable composition before curing)×100.  <Equation 1>

Dependencies are inferred from the claim text.