US 9,315,424 B2Granted

Multi-layer plate device

AssigneeComponent Re-Engineering Company, Inc.

InventorsAlfred Grant Elliot, Brent Donald Alfred Elliot, Frank Balma, Richard Erich Schuster, Dennis George Rex, Alexander Veytser

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Abstract

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

Claims19

Dependent claims

A multi-layer ceramic plate assembly for use in semiconductor processing, said multi-layer ceramic plate assembly comprising:

an upper plate layer, said upper plate layer comprising a ceramic disc;
a lower plate layer, said lower plate layer comprising ceramic;
said upper plate layer and said lower plate layer joined together to form an interior space between said upper plate layer and said lower plate layer within an annulus of an annular joining layer, and
an annular joining layer disposed between said upper plate layer and said lower plate layer, wherein said annular joining layer joins an outer periphery of said upper plate layer to an outer periphery of said lower plate layer, wherein said joining layer comprises metallic aluminum, and wherein said joining layer hermetically seals said interior space between said upper plate layer and said lower plate layer from the exterior of said ceramic plate assemble through said joining layer, wherein said joining layer hermetically seals with a joint with a vacuum leak rate of less than 1×10E−9 sccm He/sec.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 13/682,225Filed 20 Nov 2012 · us provisional application
Priority: 30 Nov 2011
Published: US 2013/0180976 A118 Jul 2013
Granted: 19 Apr 2016
Term ends: Not estimatedThe source records don’t support an estimate.

Classification60 codes

B23K 1/0008
Soldering, e.g. brazing, or unsoldering: specially adapted for particular articles or work
B23K 1/0016
Specially adapted for particular articles or work: soldering of electronic components
B23K 1/19
Soldering, e.g. brazing, or unsoldering: taking account of the properties of the materials to be soldered
B23K 1/20
Soldering, e.g. brazing, or unsoldering: preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating

Family

Application61/565,396Us provisional application · filed 30 Nov 2011
Application61/592,587Us provisional application · filed 30 Jan 2012
Application61/605,707Us provisional application · filed 1 Mar 2012
Application61/658,896Us provisional application · filed 12 Jun 2012
Application61/707,865Us provisional application · filed 28 Sep 2012
US 2013/0180976 A1Pre-grant publication · published 18 Jul 2013
US 9,315,424 B2This patent

From the US filing history. Foreign family members aren’t listed.