Method of manufacturing light-emitting device
AssigneesToyoda Gosei Co., Ltd., Sumita Optical Glass, Inc.
InventorsSeiji Yamaguchi, Koji Tasumi, Hiroyuki Tajima, Satoshi Wada, Miki Moriyama, Kazuya Aida, Hiroki Watanabe
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Abstract
A method of manufacturing a light-emitting device including a light-emitting element mounted on a substrate and sealed with a glass. The method includes heating the glass by a first mold that is heated to a temperature higher than a yield point of the glass, the glass contacting the first mold, and pressing the glass against the light-emitting element mounted on the substrate supported by a second mold to seal the light-emitting element with the glass.
Claims11
A method of manufacturing a light-emitting device comprising a light-emitting element mounted on a substrate and sealed with a glass, the method comprising:
- heating the glass by a thermal conduction from a first mold that is heated to a temperature higher than a yield point of the glass, the glass contacting the first mold;
- heating the substrate mounting the light-emitting element and held by a second mold by a thermal conduction from the second mold, the first mold and the second mold being separated from each other when heated;
- and
- pressing the glass against the light-emitting element mounted on the substrate supported by the second mold while heating the glass to the temperature higher than the yield point of the glass to seal the light-emitting element with the glass,
- wherein the glass is heated off and opposite the substrate while being held by the first mold before the pressing of the glass,
- wherein a bottom surface of an upper one of the first mold and the second mold is provided with a locking portion for holding the substrate or the glass, and
- wherein the locking portion includes a first locking claw and a second locking claw which extend along two opposite sides of the substrate so as to hold the edges of the two sides of the substrate.
Dependencies are inferred from the claim text.