Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using wire bonding

A microelectromechanical system (MEMS) package comprising:

• a MEMS substrate having a first MEMS device and a second MEMS device;
• a cap substrate secured to a top surface of the MEMS substrate, wherein the cap substrate includes a first cap and a second cap, wherein the first cap includes a first recess covering the first MEMS device and in a bottom surface of the first cap, and wherein the second cap includes a second recess covering the second MEMS device and in the bottom surface of the second cap;
• an integrated circuit die secured to a top surface of the first cap, wherein the integrated circuit die is arranged over the first recess;
• a housing covering the MEMS substrate, the cap substrate, and the integrated circuit die;
• a conductive stud or external wire bond electrically coupled with the integrated circuit die and extending between a top surface of the housing and the integrated circuit die;
• wherein the second cap is not covered by an integrated circuit die.

A microelectromechanical system (MEMS) package comprising:

• a MEMS device arranged in a MEMS substrate and covered by a cap substrate;
• an integrated circuit die secured to an upper surface of the cap substrate;
• a housing covering the MEMS substrate, the cap substrate, and the integrated circuit die;
• a redistribution layer (RDL) arranged over the housing;
• a first conductive structure extending between the integrated circuit die and the RDL;
• and
• a second conductive structure extending between the RDL and the MEMS substrate, and electrically coupled with the MEMS device through the MEMS substrate;
• wherein the RDL electrically couples the first and second conductive structures together, such that the integrated circuit die is electrically coupled to the MEMS device through the RDL.