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US 9,315,375 B2Granted
Method using glass substrate anodic bonding
AssigneeInnovative Micro Technology
InventorsBenedikt Zeyen, Jeffery F. Summers
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Abstract
A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.
Claims19
A method of forming a substrate pair assembly, comprising:
- providing a first optically transparent substrate and a second optically transparent substrate;
- depositing a first layer of metal material on the first optically transparent substrate;
- forming a first layer of metal oxide material wherein the metal oxide is the oxidation product of the metal material and the first optically transparent substrate, and is formed during the depositing of the metal material;
- patterning the first layer of the metal material to create a metal feature;
- forming a second layer of metal oxide material, wherein the second layer of metal oxide is the oxidation product of the metal material and the second optically transparent substrate;
- and is disposed between the second optically transparent substrate and the metal feature, wherein the layer of metal material and the first and second layers of metal oxide form a first anodic bond between the first optically transparent substrate and the second optically transparent substrate and
- forming a first layer of a second bonding material on at least one of the first and the second optically transparent substrate, and patterning the first layer to form a first feature of the second bonding material;
- and
- bonding the first optically transparent substrate to the second optically transparent substrate with a second bond of the second bonding material.
6 more elements
Dependencies are inferred from the claim text.