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AssigneeAsm Technology Singapore Pte Ltd
InventorsWai Wah Lee, Jun Feng Li, Wei Boon Wong, Soo Kin Kenny Tan
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A method of recovering a bonding apparatus from a bonding failure to resume a normal operating state for semiconductor chip fabrication is disclosed. The bonding apparatus comprises: i) a bonding tool for bonding a wire between a semiconductor chip and a substrate; and ii) a position sensor. Specifically, the method comprises the steps of: a) the position sensor determining a position of the bonding tool when the bonding tool contacts a surface to bond the wire to the substrate; b) the bonding apparatus detecting a bonding failure caused by detachment of the semiconductor from the substrate based on the position of the bonding tool; and c) the bonding apparatus detaching the semiconductor chip from the wire.
A method of recovering a bonding apparatus during a bonding failure to resume a normal operating state for semiconductor chip fabrication, the bonding apparatus having a bonding tool for bonding a wire between a semiconductor chip and a substrate, and a position sensor, the method comprising the steps of:
A method of recovering a bonding apparatus during a bonding failure to resume a normal operation state for semiconductor chip fabrication, the bonding apparatus being for bonding a wire between a semiconductor chip and a substrate, and the bonding apparatus comprising an electrode for generating an electric discharge, the method comprising the steps of:
Dependencies are inferred from the claim text.