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US 9,314,612 B2Granted
Medical electrical lead
AssigneeMedtronic, Inc.
InventorsMichael R Dollimer, Gregory A Boser, Mark D Breyen
Life of this patent
Estimating the term…
Abstract
An improved medical electrical lead is disclosed herein. The lead may include a longitudinally extending body having a distal end, a proximal end, a conductive element extending between the distal and proximal ends, and an electrode coupled to the conductive element utilizing a reflow process. The conductive element and electrode may comprise materials that are incompatible.
Claims12
A method for manufacturing an implantable medical electrical lead device, comprising:
- providing a lead sub-assembly having an electrode, an elongate conductor and a first insulative layer covering the elongate conductor;
- exposing a portion of the elongate conductor at a predetermined location;
- positioning an electrode adjacent to the exposed conductor;
- reflowing the exposed conductor into a molten state, wherein the reflowing comprises heating the lead sub-assembly to a temperature that causes the melting of the elongate conductor without melting the electrode;
- and
- manipulating the reflown exposed conductor to cover a portion of the electrode.
3 more elements
An implantable medical electrical lead device, comprising:
- a lead body having a length between a proximal end and a distal end, wherein the lead body defines a longitudinal axis extending between the proximal end and the distal end;
- a conductive element located within an interior of the lead body and extending along the longitudinal axis for at least a portion of the length of the lead body, wherein the conductive element has a first thermal melting point;
- and
- an electrode having a second thermal melting point that is higher than the first thermal melting point that is positioned over the exterior surface of the lead body and bonded to the conductive element at a coupling joint, wherein the coupling joint is formed by reflowing the conductive element onto the electrode, and wherein the reflowing comprises heating the lead sub-assembly to a temperature that causes the melting of the elongate conductor without melting the electrode.
1 more element
Dependencies are inferred from the claim text.