Multi-component heatsink with self-adjusting pin fins

An apparatus, comprising:

• a printed circuit board having a first surface securing a plurality of components, wherein at least two of the components have different heights above the surface of the printed circuit board;
• a pin fin heatsink including a rigid plate and a plurality of pin fins, wherein the rigid plate has a two dimensional array of holes through the plate from a first face of the plate to a second face of the plate, and wherein each pin fin is received in one of the holes and has a proximal end extending beyond the first face of the plate, a distal end extending beyond the second face of the plate for convective heat exchange with air, a biasing member biasing the pin fin in a proximal direction into contact with one of the components, and a shoulder limiting the proximal extension of the pin fin through the hole, wherein the rigid plate is secured to the printed circuit board so that each component is contacted by the proximal end of one or more pin fins that are aligned with the component.