Method of manufacturing printed wiring board
AssigneeMitsubishi Electric Corporation
InventorsSohei Samejima, Tsuyoshi Ozaki, Hiroyuki Osuga, Teruhiko Kumada
Life of this patent
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Abstract
A method of manufacturing a printed wiring board (10) includes the steps of: forming a core including carbon fiber reinforced plastic having a primary through hole (3a); forming a first adhesive member (4a) on a lower surface of the core to cover the primary through hole (3a); charging an insulating member into the primary through hole (3a); forming a second adhesive member (4b) on an upper surface of the core; forming a third adhesive member (6a) below the first adhesive member (4a); forming a fourth adhesive member (6b) on the second adhesive member (4b); and forming interconnections on the core.
Claims3
A method of manufacturing a printed wiring board, comprising the steps of:
- forming first and second laminated bodies each having first and second adhesive members;
- laminating said first laminated body and said second laminated body so that said first laminated body and said second laminated body are symmetric to each other about a central line located between said first and second laminated bodies, by forming a positioning hole in said first laminated body when said first and second adhesive members are in an uncured state, and inserting a positioning member into said positioning hole to perform positioning;
- and
- forming interconnections on said first and second laminated bodies,
- wherein said step of forming said first and second laminated bodies includes the steps of
- forming a core including carbon fiber reinforced plastic having a primary through hole,
- temporarily pressure-bonding the first adhesive member on a lower surface of said core to cover said primary through hole,
- charging an insulating member into said primary through hole by screen printing, and
- temporarily pressure-bonding the second adhesive member on said insulating member on an upper surface of said core, and
- wherein the insulating member is charged after formation of the first adhesive member.
Dependencies are inferred from the claim text.