Printed wiring board

A method for manufacturing a printed wiring board, comprising:

• forming a penetrating hole through an insulative resin substrate;
• forming a first conductive layer on a first surface of the insulative resin substrate;
• forming a second conductive layer on a second surface of the insulative resin substrate on an opposite side with respect to the first surface;
• and
• forming in the penetrating hole a through-hole conductor connecting the first conductive layer and the second conductive layer,
• wherein the forming of the through-hole conductor includes forming a seed layer on an inner wall of the penetrating hole, forming on the seed layer a first electrolytic plated layer such that the first electrolytic plated layer fills a space formed by the seed layer in the penetrating hole and forms recessed portions at end portions of the penetrating hole, respectively, and forming a plurality of second electrolytic plated layers such that the second electrolytic plated layers fill the recessed portions formed by the first electrolytic plated layer, respectively, and the forming of the second electrolytic plated layers comprise forming electrolytic plating having an average crystalline particle diameter which is greater than an average crystalline particle diameter of electrolytic plating forming the first electrolytic plated layer.