Method for manufacturing a double-sided printed circuit board

A method for manufacturing a double-sided flexible printed circuit board, the method comprising the steps of:

• (A) preparing a single-sided copper clad laminate or forming a copper layer on a single side of a base member to manufacture the single-sided copper clad laminate;
• (B) forming a primer layer on an opposite side of the copper clad laminate in order to improve adhesive force;
• (C) forming via-holes in the single-sided copper clad laminate;
• (D) printing a conductive paste on the other side of the copper foil of the single-sided copper clad laminate to form a plated bottom layer on the via-hole simultaneously with forming a circuit pattern;
• (E) plating a copper clad surface of the single-sided copper clad laminate, the via-hole including the plated bottom layer formed thereon, and the circuit pattern formed by printing the conductive paste;
• (F) forming a coverlay layer on the conductive paste-printed surface;
• and (G) etching the copper clad surface of the copper clad laminate to form a circuit.