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AssigneeAdvanced Flexible Circuits Co., Ltd.
InventorsChih-Heng Chuo, Kuo-Fu Su, Gwun-Jin Lin
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An attenuation reduction structure of a circuit board includes an expanded thickness formed between high frequency signal contact pads and a grounding layer of the circuit board. The expanded thickness is greater than a reference thickness between the grounding layer and high frequency signal lines. The circuit board is made of polyethylene terephthalate (PET) or polyimide (PI). Alternatively, a rigid board including resin and fibrous material or a rigid-flex board is used. The circuit board can be a single-layer circuit board or a multi-layer board formed by combining at least two single-layer circuit boards. A thickness-expanding pad is mounted between the high frequency signal contact pads and the grounding layer or the thickness of a portion of a bonding layer of the circuit board is increased to provide an expanded thickness.
An attenuation reduction structure for a circuit board having a wiring mounting surface and a grounding line mounting surface, a contact pad mounting section being defined on the wiring mounting surface of the circuit board, comprising:
Dependencies are inferred from the claim text.