Substrate structure and manufacturing method thereof

A manufacturing method of a substrate structure, comprising:

• providing a substrate, the substrate comprising a supporting layer, two release layers and two base metal layers, the two release layers disposed on two opposite surfaces of the supporting layer respectively, the two base metal layers covering the two release layers respectively;
• forming two etch stop layers on each of the base metal layers;
• forming two patterned metal layers on each of the etch stop layers, each of the patterned metal layers comprising a plurality of openings to expose a corresponding portion of the etch stop layer, wherein each of the etch stop layers is located between each of the base metal layers and each of the patterned metal layers;
• forming two first patterned solder-resist layers on each of the patterned metal layers to cover the exposed portion of the base metal layer;
• laminating a stacking layer on each of the patterned metal layers, each of the stacking layers covering the corresponding first patterned solder-resist layer, wherein each of the stacking layers comprises a dielectric layer and a metal foil, and each of the dielectric layers is disposed between the corresponding patterned metal layer and the corresponding metal foil;
• separating each of the base metal layers from the release layer to remove the supporting layer;
• removing each of the base metal layers by etching to expose each of the etch stop layers;
• and
• removing each of the etch stop layers to expose each of the patterned metal layers and each of the first patterned solder-resist layers.