Printed circuit board, printed circuit board assembly sheet and method of manufacturing the same
AssigneeNitto Denko Corporation
InventorsTerukazu Ihara, Naohiro Terada
Life of this patent
Estimating the term…
Abstract
A determination mark formation portion is provided in each suspension board. In the determination mark formation portion, a recess having a given depth is provided in a base insulating layer. An outer peripheral portion is formed on the base insulating layer to surround the recess. A plating layer is formed on the outer peripheral portion. A circular hole is formed on a support substrate. The hole of the support substrate and the recess of the base insulating layer overlap each other.
Claims6
A printed circuit board comprising:
- a support substrate having a first opening;
- a base insulating layer formed on said support substrate to cover said first opening, the base insulating layer having a recess which overlaps the first opening, the recess having an open upper end and a closed bottom surface;
- a conductor pattern formed on said base insulating layer;
- a metal layer formed on said base insulating layer to surround the recess of said base insulating layer, a second opening formed in the metal layer, the second opening overlapping the recess;
- and
- ink applied to at least a portion of the closed bottom surface of the recess.
A printed circuit board assembly sheet comprising a plurality of printed circuit boards which are integrally provided, each of the plurality of printed circuit boards comprising:
- a support substrate having a first opening;
- a base insulating layer formed on said support substrate to cover said first opening, the base insulating layer having a recess which overlaps the first opening, the recess having an open upper end and a closed bottom surface;
- a conductor pattern formed on said base insulating layer;
- and
- a metal layer formed on said base insulating layer to surround the recess of said base insulating layer, a second opening formed in the metal layer, the second opening overlapping the recess,
- wherein ink is applied to at least a portion of the closed bottom surface of the recess of at least one printed circuit board of said plurality of printed circuit boards, such that the at least one printed circuit board is determined to be acceptable or defective.
Dependencies are inferred from the claim text.