Electronic device and noise suppression method

An electronic device comprising:

• a first interconnect substrate;
• and
• a second interconnect substrate connected to the first interconnect substrate,
• wherein the first interconnect substrate includes a first conductor, the second interconnect substrate includes a second conductor of which at least a portion is formed in a region opposite the first conductor, the second conductor forms a repeated structure of conductors, and the second conductor is electrically isolated from other conductors included in the second interconnect substrate,
• wherein the first conductor comprises a portion of an electromagnetic band gap (EBG) structure and the second conductor comprises a portion of the EBG structure,
• wherein one element selected from a group consisting of the first conductor and the second conductor comprises a sheet-like conductor,
• wherein another element selected from the group consisting of the first conductor and the second conductor forms a plurality of insular conductors separated from each other,
• wherein the electronic device further comprises:
• a plurality of auxiliary connecting members provided to the plurality of insular conductors and connecting the insular conductors to the sheet-like conductor,
• wherein at least one auxiliary connecting member of said plurality of auxiliary connecting members includes:
• a plurality of pins connected to one element selected from a group consisting of the sheet-like conductor and the plurality of insular conductors, the plurality of pins corresponding to the plurality of insular conductors;
• and
• a socket connected to another element selected from the group consisting of the sheet-like conductor and the plurality of insular conductors, and
• wherein the plurality of pins are inserted into the socket.

A noise suppression method comprising:

• providing a first conductor in a first interconnect substrate over which electrical parts are to be mounted;
• providing a second conductor in at least a portion of a region in a second interconnect substrate, the region being opposite the first conductor, wherein the first interconnect substrate and the electrical parts are to be mounted over the second interconnect substrate;
• forming a repeated structure of at least either the first conductor or the second conductor, and forming at least a portion of an electromagnetic band gap (EBG) structure by the first conductor and the second conductor, the method preventing a noise from propagating through a space between the first interconnect substrate and the second interconnect substrate;
• providing a socket including a connection portion that is formed on the first conductor of the first interconnect substrate, and includes an insertion portion;
• and
• providing a connecting member that is formed on the second conductor of the second interconnect substrate, and inserted into the insertion portion,
• wherein the second interconnect substrate comprises a package interconnect substrate.

An electronic device comprising:

• a first interconnect substrate including a first conductor;
• a second interconnect substrate connected to the first interconnect substrate and comprising a plurality of conductors including a second conductor which is formed opposite the first conductor and is electrically isolated from other conductors in the plurality of conductors;
• and
• an electromagnetic band gap (EBG) structure formed in a space between the first and second interconnect substrates, and comprising:
• the first and second conductors;
• a socket including a connection portion that is formed on the first conductor of the first interconnect substrate, and includes an insertion portion;
• and
• a connecting member that is formed on the second conductor of the second interconnect substrate, and inserted into the insertion portion,
• wherein the second interconnect substrate comprises a package interconnect substrate.