Conformal coating including embedded thermal energy absorbing material

An apparatus comprising:

• electrical components;
• a conformal coating molded around the electrical components to substantially seal the electrical components while also serving as an outer surface of the apparatus, the conformal coating including microencapsulated thermal energy storage material embedded in the conformal coating to absorb heat generated by the electrical components;
• and
• a display responsive to signals from at least one of the electrical components, the display to detachably couple to the outer surface of the conformal coating and to receive the signals via one or more connectors routed through the outer surface of the conformal coating.

A method comprising:

• obtaining a molding material that is in a liquid phase;
• adding microencapsulated thermal energy storage material to the molding material to embed the microencapsulated thermal energy storage material in the molding material;
• and
• over-molding electrical components and power source circuitry of a computing device with the liquid phase molding material having the embedded thermal storage material, the over-molding to result in a conformal coating to substantially seal the electrical components and the power source circuitry to form an outer surface of the computing device once the molding material is cooled or cured to cause the molding material to be in a solid phase, the power source circuitry comprising an inductive coil and a battery to store electrical power to be generated by the inductive coil when inductively coupled to an induction charger, the battery electrically coupled to the electrical component to provide electrical power to the electrical components.