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US 9,313,832 B2Granted
Method and system for localized heat treating using susceptor
AssigneeHarsco Corporation
InventorTheodore William Fandrei, II
Life of this patent
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Abstract
A system or method for heat treating a localized area of a component part includes providing a susceptor, shaping the susceptor to conform to the component part, a component part, and a heat source, heating the susceptor by the heat source, and introducing the susceptor to the desired target area of the component part for a controlled or predetermined interval as necessary to achieve a desired metallurgical effect to take place with respect to the desired target area.
Claims11
A method for heat treating a localized area of a component part, comprising:
- providing a susceptor, a component part, and a heat source;
- shaping the susceptor to include a feature corresponding to a negative impression of a desired target area of the component part;
- heating the susceptor by the heat source separately from the component part;
- controlling the temperature of the susceptor to a predetermined temperature suitable for heat treatment of the desired target area of the component part prior to introducing the susceptor to the component part;
- and
- applying the susceptor to the desired target area of the component part after the susceptor reaches the predetermined temperature for a controlled or predetermined interval as is necessary to achieve a desired metallurgical effect to take place with respect to the desired target area.
3 more elements
Dependencies are inferred from the claim text.