Image detector with lens assembly and related methods

A lens assembly for an electronic device having a substrate comprising a dielectric layer, and a plurality of electrically conductive traces over the dielectric layer, and an image sensor integrated circuit (IC) over the substrate, the lens assembly comprising:

• a spacer above the substrate;
• a first adhesive layer over said spacer;
• at least one lens aligned with the image sensor IC and over said first adhesive layer;
• a second adhesive layer surrounding a peripheral surface of said at least one lens and said first adhesive layer;
• and
• a baffle over said at least one lens and said second adhesive layer.

A method making a plurality of lens assemblies comprising:

• adhesively joining a lens wafer to a spacer wafer with a first adhesive layer, the lens wafer comprising a plurality of lenses;
• forming a plurality of recesses extending through the lens wafer and first adhesive layer, and into the spacer wafer, each recess being between adjacent lenses;
• filling the recesses with a second adhesive layer;
• adhesively joining a baffle wafer onto the second adhesive layer;
• and
• dicing the joined-together spacer wafer, lens wafer, and baffle wafer to define the plurality of lens assemblies.

A method making an electronic device comprising:

• forming a substrate comprising a dielectric layer, and a plurality of electrically conductive traces over the dielectric layer;
• forming an image sensor integrated circuit (IC) over the substrate;
• and
• forming a lens assembly above the substrate, the lens assembly comprising
• a spacer above the substrate,
• a first adhesive layer over the spacer,
• at least one lens aligned with the image sensor IC and over the first adhesive layer,
• a second adhesive layer surrounding a peripheral surface of the at least one lens and the first adhesive layer, and
• a baffle over the at least one lens and the second adhesive layer.