Scheme for 3D voltage type TSV signal transmission
AssigneeNational Tsing Hua University
InventorsMeng-Fan Chang, Tsung-Hsien Huang, Pei-Yuan Li
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Abstract
A method for 3D voltage type TSV signal transmission, comprising transmitting a full swing signal of data with a first voltage through TSVs for each one of a plurality of slave devices to determine a transmission time required for data transmission to a master device. Then, full swing signal is sensed by the master device for reduce the first voltage to be a small swing signal with lower voltage. Logic “0” signals or logic “1” signals with the lower voltage are transmitted through the TSVs by the plurality of slave devices. It is sharing charge and balancing voltage level to a mean value for the logic “1” signals or the logic “0” signals by the master device.
Claims17
A method for 3D voltage type TSV signal transmission, comprising:
- transmitting a full swing signal of data with a first voltage through TSVs for each one of a plurality of slave devices to determine a transmission time required for said data transmission to a master device;
- sensing said full swing signal by said master device for reduce said first voltage to be a second voltage lower than said first voltage;
- transmitting logic “0” signals or logic “1” signals with said second voltage through said TSVs by said plurality of slave devices;
- and
- sharing charge of said TSV and balancing voltage level transmitted through said TSV to a mean value for said logic “1” signals or said logic “0” signals by said master device.
Dependencies are inferred from the claim text.