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US 9,312,607 B2Granted
Load spreading interposer
AssigneeRaytheon Company
InventorSteven R. Wolf
Life of this patent
Estimating the term…
Abstract
A package for active electronics is provided. The package includes a housing structure configured to house the active electronics, a connector element and an interposer element disposed to define a tie point between the housing structure and the connector element such that the tie point is remote from respective edges of the housing structure and the connector element.
Claims17
A package for active electronics, comprising:
- a housing structure configured to house the active electronics;
- a connector element;
- and
- an interposer element adhered to the housing structure by epoxy, mechanically fastened to the connector element and disposed to define a tie point between the housing structure and the connector element such that the tie point is remote from respective edges of the housing structure and the connector element.
1 more element
A package for active electronics, comprising:
- a housing structure having a housing and a substrate porch on which pin connectors are disposed;
- a connector element having a spacer portion corresponding to the housing and a connector portion corresponding to the substrate porch and defining connector elements receptive of the pin connectors;
- and
- an interposer element interposed between the housing and the spacer portion, the interposer element being adhered to the housing by epoxy and mechanically fastened to the spacer portion.
1 more element
A package for active electronics, the package comprising:
- a housing structure having a housing for active electronics at a first side thereof and a substrate porch on which pin connectors are disposed at a second side thereof;
- a connector element including a spacer portion having a first thickness at a first side thereof and a connector portion at a second side thereof, the respective first and second sides of the housing and the connector element corresponding with each other such that the spacer portion is disposed in positional correspondence with the housing and the connector portion is disposed in positional correspondence with the substrate porch,
- the connector portion defining connector elements receptive of the pin connectors and having a second thickness, which is greater than the first thickness;
- and
- an interposer element adjacent to a section of the connector portion, interposed between the housing and the spacer portion, adhered to the housing and fastened to the connector element spacer portion.
2 more elements
Dependencies are inferred from the claim text.