Lightweight cavity filter and radio subsystem structures
AssigneeIntel Corporation
InventorsIan Burke, Jason Cook, Ahmad Khanifar
Life of this patent
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AssigneeIntel Corporation
InventorsIan Burke, Jason Cook, Ahmad Khanifar
Estimating the term…
Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and radio subsystems such as antennas and filters. The novel structures are fabricated by electroplating the required structure over a mold, housing, or substrate. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.
A cavity filter, comprising:
A method for forming a lightweight cavity filter structure, comprising:
Dependencies are inferred from the claim text.