Multilayer electronic structure with novel transmission lines

A method of fabricating a signal carrier for carrying a signal in a direction within an X-Y plane of a multilayer composite electronic structure comprising a plurality of dielectric layers extending in the X-Y plane, the signal carrier comprising a transmission line comprising a lower continuous metallic line and a metallic via line that comprises either a continuous via post or discrete via posts, the metallic via line stands on and are conductively coupled to the lower continuous metal line, wherein the transmission line is separated by a lower layer of the plurality of dielectric layers from an underlying continuous metal reference plane, comprising the steps of:

• (a) obtaining a substrate;
• depositing thereover the continuous metal reference plane;
• (b) covering the continuous metal reference plane with the lower layer of the plurality of dielectric layers;
• (c) fabricating the lower continuous metallic conducting line;
• (d) fabricating the metallic via line over the lower continuous metallic conducting line by pattern plating or by panel plating;
• (e) laminating a further dielectric layer of the plurality of dielectric layers over the metallic via line and the lower continuous metallic conducting line;
• (f) thinning the further dielectric layer to expose a top surface of the metallic via line;
• (g) depositing a top conducting line over the metallic via line, and
• (h) laminating an upper layer of the plurality of dielectric layers over the top conducting line.