Back to results
US 9,312,459 B2Granted
Light emitting device having vertical structure and package thereof
AssigneesLG Electronics Inc., LG Innotek Co., Ltd.
InventorsJun Ho Jang, Geun Ho Kim
Life of this patent
Estimating the term…
Abstract
A light emitting device having a vertical structure and a package thereof, which are capable of damping impact generated in a substrate separation process, and achieving an improvement in mass productivity. The device and package include a sub-mount, a first-type electrode, a second-type electrode, a light emitting device, a zener diode, and a lens on the sub-mount.
Claims29
A light emitting device package comprising:
- a sub-mount having a first surface and a second surface;
- a first metal layer on the first surface of the sub-mount;
- a second metal layer on the second surface of the sub-mount;
- a light emitting device on the first surface, the light emitting device comprising a supporting layer including an anti-diffusion layer, a first electrode on the supporting layer, a semiconductor light emitting structure electrically connected to the first electrode, and a second electrode electrically connected to the semiconductor light emitting structure, wherein the first electrode is electrically connected to the first metal layer and the second electrode is electrically connected to the second metal layer, wherein the semiconductor light emitting structure comprises a light extraction structure,
- a zener diode on the second surface such that the zener diode is electrically connected to the first metal layer and the second metal layer wherein the zener diode is a distance apart from the light emitting device, and
- a lens on the sub-mount, wherein the lens is on the light emitting device,
- wherein at least one of the first metal layer and the second metal layer directly contacts the sub-mount,
- wherein the sub-mount has a cavity, the cavity having a bottom portion and an inclined portion, and
- wherein the first metal layer has an inclined surface, and the inclined surface of the first metal layer is on the inclined portion of the cavity.
6 more elements
A light emitting device package comprising:
- a sub-mount having a first surface and a second surface;
- a first metal layer on the first surface of the sub-mount;
- a second metal layer on the second surface;
- a light emitting device on the first surface, the light emitting device comprising a supporting layer including an anti-diffusion layer, a first electrode on the supporting layer, a semiconductor light emitting structure electrically connected to the first electrode, and a second electrode electrically connected to the semiconductor light emitting structure, wherein the first electrode is electrically connected to the first metal layer and the second electrode is electrically connected to the second metal layer, wherein the semiconductor light emitting structure comprises a light extraction structure,
- a zener diode on the second surface such that the zener diode is electrically connected to the first-type electrode and the second-type electrode, wherein the zener diode is a distance apart from the light emitting device, and
- a lens on the sub-mount, wherein the lens is on the light emitting device,
- wherein the lens is on a region vertically overlapped with the zener diode, and
- wherein at least one of the first metal layer and the second metal layer directly contacts the sub-mount.
5 more elements
A light emitting device package comprising:
- a sub-mount having a first surface and a second surface;
- a first metal layer on the first surface of the sub-mount;
- a second metal layer on the second surface of the sub-mount;
- a light emitting device on the first surface, the light emitting device comprising a supporting layer including an anti-diffusion layer, a first electrode on the supporting layer, a semiconductor light emitting structure electrically connected to the first electrode, and a second electrode electrically connected to the semiconductor light emitting structure, wherein the first electrode is electrically connected to the first metal layer and the second electrode is electrically connected to the second metal layer, wherein the semiconductor light emitting structure comprises a light extraction structure,
- a zener diode on the second surface such that the zener diode is electrically connected to the first metal layer and the second metal layer, wherein the zener diode is arranged a distance apart from the light emitting device, and
- a lens on the sub-mount, wherein the lens is over the light emitting device,
- wherein a height of a top surface of light emitting device is less than a height of a second surface,
- wherein the sub-mount has a cavity, the cavity having a bottom portion and an inclined portion, and
- wherein the first metal layer has an inclined surface, and the inclined surface of the first metal layer is on the inclined portion of the cavity.
6 more elements
A light emitting device package comprising:
- a sub-mount having;
- a first metal layer and a second metal layer on a same direction of the sub-mount;
- a light emitting device on a first surface, the light emitting device comprising a supporting layer including an anti-diffusion layer, a first electrode on the supporting layer, a semiconductor light emitting structure electrically connected to the first electrode, and a second electrode electrically connected to the semiconductor light emitting structure, wherein the first electrode is electrically connected to the first metal layer and the second electrode is electrically connected to the second metal layer, wherein the semiconductor light emitting structure comprises a light extraction structure,
- a zener diode on a second surface such that the zener diode is electrically connected to the first metal layer and the second metal layer, wherein the zener diode is a distance apart from the light emitting device, and
- a lens on the sub-mount, wherein the lens is on the light emitting device,
- wherein the sub-mount has a cavity, the cavity having a bottom portion and an inclined portion, and
- wherein the first metal layer has an inclined surface, and the inclined surface of the first metal layer is on the inclined portion of the cavity.
4 more elements
Dependencies are inferred from the claim text.