Method for fabricating light emitting diode (LED) dice with wavelength conversion layers
AssigneeSemiLEDS Optoelectronics Co., Ltd.
InventorsJui-Kang Yen, De-Shuo Chen
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Abstract
A method for fabricating light emitting diode (LED) dice includes the step of providing a wavelength conversion layer on a substrate on an adhesive layer configured to have reduced adhesiveness upon exposure to a physical energy, such as electromagnetic radiation or heat. The method also includes the step of exposing the adhesive layer on the substrate to the physical energy to reduce the adhesiveness of the adhesive layer, removing the wavelength conversion layer from the substrate, and attaching the wavelength conversion layer to the light emitting diode (LED) die.
Claims15
A method for fabricating light emitting diode (LED) dice comprising:
- providing a light emitting diode (LED) die;
- providing a plurality of wavelength conversion layers on a substrate on an adhesive layer configured to have reduced adhesiveness upon exposure to a physical energy;
- exposing the adhesive layer in an area corresponding to a wavelength conversion layer on the substrate to the physical energy to reduce the adhesiveness of the adhesive layer in the area and facilitate removal of the wavelength conversion layers individually from the substrate;
- aligning the wavelength conversion layer to a capillary device;
- removing the wavelength conversion layer from the substrate using the capillary device;
- and
- placing the wavelength conversion layer to on the light emitting diode (LED) die using the capillary device.
A method for fabricating light emitting diode (LED) dice comprising:
- providing a plurality of wavelength conversion layers on a substrate on an adhesive layer configured to have reduced adhesiveness upon exposure to a physical energy;
- providing a curing apparatus configured to apply the physical energy to the adhesive layer;
- providing an attachment apparatus configured to remove the wavelength conversion layers one at a time from the substrate and to attach the wavelength conversion layers to the light emitting diode (LED) die;
- exposing the adhesive layer on the substrate to the physical energy using the curing apparatus to reduce the adhesiveness of the adhesive layer in selected areas, with each area corresponding to a wavelength conversion layer;
- and
- removing the wavelength conversion layers from the substrate and attaching the wavelength conversion layers to the light emitting diode (LED) dice one at a time using the attachment apparatus.
Dependencies are inferred from the claim text.