Method for producing a conversion lamina and conversion lamina
AssigneeOSRAM Opto Semiconductors GmbH
InventorMarkus Richter
Life of this patent
Estimating the term…
Abstract
A method for producing at least one conversion lamina for a radiation-emitting semiconductor component is specified. A base material including a conversion substance contained therein is applied to a substrate by means of a double-layered stencil. Furthermore, a conversion lamina for a radiation-emitting semiconductor component includes a base material and a conversion substance embedded therein. The thickness of the conversion lamina is in a range of between 60 μm and 170 μm inclusive.
Claims13
A method for producing at least one conversion lamina for a radiation-emitting semiconductor component, the method comprising:
- applying a base material comprising a conversion substance contained therein onto a substrate using a double-layer template,
- wherein the base material contains silicone;
- wherein the substrate is a film substrate which is arranged on a clamping device,
- wherein the template comprises two regions, which are arranged vertically above one another, a shaping region facing toward the substrate replicating a shape of the conversion lamina to be produced and a region facing away from the substrate having a grid structure for stabilization of the template;
- wherein each grid structure is composed of a plurality of openings arranged as a grid, each opening of the grid structure having a smaller lateral extent than the shaping region, so that a plurality of the openings, arranged in the manner of a matrix, of the grid structure are arranged over each shaping region;
- wherein the template consists substantially of nickel;
- and
- wherein the shaping region is formed such that a produced conversion lamina has a recess arranged in an intended bonding pad region of a radiation-emitting semiconductor component.
A method for producing at least one conversion lamina for a radiation-emitting semiconductor component, the method comprising:
- applying a base material comprising a conversion substance contained therein onto a substrate using a double-layer template;
- wherein the template comprises two regions, which are arranged vertically above one another, a shaping region facing toward the substrate replicating a shape of the conversion lamina to be produced and a region facing away from the substrate having a grid structure for stabilization of the template;
- wherein each grid structure is composed of a plurality of openings arranged as a grid, each opening of the grid structure having a smaller lateral extent than the shaping region, so that a plurality of the openings, arranged in the manner of a matrix, of the grid structure are arranged over each shaping region;
- and
- wherein the shaping region is formed such that a produced conversion lamina has a recess arranged in an intended bonding pad region of a radiation-emitting semiconductor component.
Dependencies are inferred from the claim text.