Method of cutting light-emitting device chip wafer by using laser scribing
AssigneeSamsung Electronics Co., Ltd.
InventorYu-sung Jang
Life of this patent
Estimating the term…
Abstract
Methods of cutting a light-emitting device chip wafer by using a laser scribing process. The method includes: preparing a wafer that has a plurality of semiconductor chips on an upper surface of the wafer; attaching a first tape covering the semiconductor chips to the upper surface of the wafer; forming scribing lines to define each of the semiconductor chips on the wafer by irradiating a laser beam onto a lower surface of the wafer; attaching a second tape to the lower surface of the wafer; and breaking the wafer into a plurality of chips by applying a physical force to the wafer along the scribing lines.
Claims9
A method of cutting a wafer, the method comprising:
- preparing the wafer having a plurality of semiconductor chips on an upper surface of the wafer;
- attaching a first tape covering the semiconductor chips to the upper surface of the wafer;
- forming scribing lines to define each of the semiconductor chips on the wafer by irradiating a laser beam onto a lower surface of the wafer;
- attaching a second tape to the lower surface of the wafer;
- and
- cutting the wafer into a plurality of chips by applying a physical force to the wafer along the scribing lines, while the first and second tapes remain attached to the upper surface and the lower surface of the wafer, respectively,
- wherein the first tape and the second tape are not cut during the cutting of the wafer.
A method of cutting a wafer, the method comprising:
- preparing the wafer having a plurality of semiconductor chips on an upper surface of the wafer;
- mounting the wafer on a wafer ring having a first tape attached thereto such that the first tape covers the semiconductor chips on the upper surface of the wafer;
- forming scribing lines to define each of the semiconductor chips on the wafer by irradiating a laser beam onto a lower surface of the wafer while moving the wafer ring in a predetermined direction;
- after forming the scribing lines, attaching a second tape to the lower surface of the wafer;
- and
- cutting the wafer into a plurality of chips by applying a physical force to the upper surface of the wafer along the scribing lines, while the first and second tapes remain attached to the upper surface and the lower surface of the wafer, respectively,
- wherein the first tape and the second tape are not cut during the cutting of the wafer.
Dependencies are inferred from the claim text.