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US 9,312,352 B2Granted
Field-effect transistor and fabricating method thereof
AssigneeUnited Microelectronics Corp.
InventorsKun-Yuan Lo, Chih-Wei Yang, Cheng-Guo Chen, Rai-Min Huang, Jian-Cun Ke
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Abstract
A method for fabricating a field-effect transistor is provided. The method includes: forming a gate dielectric layer and a barrier layer on a substrate in sequence; forming a first silicon layer on and in contact with the barrier layer; performing a thermal treatment to form a silicide layer between the barrier layer and the first silicon layer; and forming a second silicon layer on and in contact with the first silicon layer.
Claims8
A method for fabricating a field-effect transistor comprising:
- forming a gate dielectric layer and a barrier layer on a substrate in sequence;
- forming a first silicon layer on and in contact with the barrier layer;
- performing a thermal treatment to form a silicide layer between the barrier layer and the first silicon layer;
- forming a second silicon layer on and in contact with the first silicon layer;
- patterning the second silicon layer, the first silicon layer, the barrier layer and the gate dielectric layer to form a dummy gate structure;
- and
- forming a metal gate electrode to take the place of a patterned second silicon layer and a patterned first silicon layer.
4 more elements
Dependencies are inferred from the claim text.