Semiconductor apparatus and electronic apparatus
AssigneeSony Corporation
InventorTakuya Nakamura
Life of this patent
Estimating the term…
Abstract
A semiconductor apparatus includes a first semiconductor chip, a second semiconductor chip, and a flare prevention plate. On the first semiconductor chip, a photoelectric conversion unit configured to perform photoelectric conversion on light received in a light receiving area is formed. The second semiconductor chip is electrically connected to the first semiconductor chip, the second semiconductor chip being disposed on a surface of the first semiconductor chip on a side of the light receiving area. The flare prevention plate is disposed on the second semiconductor chip, the flare prevention plate being configured to block light, the flare prevention plate being in contact with the second semiconductor chip.
Claims6
A semiconductor apparatus, comprising:
- a first semiconductor chip configured to include at least one photoelectric conversion unit to perform photoelectric conversion on light received in a light receiving area is formed;
- a second semiconductor chip electrically connected to the first semiconductor chip;
- and
- a flare prevention plate disposed on the first semiconductor chip, the flare prevention plate being configured to block light,
- wherein a film of heat dissipating resin or a thermal conductor is disposed between the flare prevention plate and the first semiconductor chip,
- wherein an end portion of the flare prevention plate on a side of the light receiving area is disposed so as to protrude from an end portion of the second semiconductor chip on a side of the light receiving area by not less than 200 pm.
An electronic apparatus, comprising;
- a semiconductor apparatus including:
- a first semiconductor chip configured to include at least one photoelectric conversion unit to perform photoelectric conversion on light received in a light receiving area is formed;
- a second semiconductor chip electrically connected to the first semiconductor chip;
- and
- a flare prevention plate disposed on the first semiconductor chip, the flare prevention plate being configured to block light,
- wherein a film of heat dissipating resin or a thermal conductor is disposed between the flare prevention plate and the first semiconductor chip,
- wherein an end portion of the flare prevention plate on a side of the light receiving area is disposed so as to protrude from an end portion of the second semiconductor chip on a side of the light receiving area by not less than 200 pm.
Dependencies are inferred from the claim text.