Semiconductor packages

A semiconductor package comprising:

• a die package comprising:
• a first substrate;
• at least one die disposed over a first surface of the first substrate;
• and
• a first plurality of conductive features formed at a second surface of the first substrate opposite the first surface;
• a second substrate having a second plurality of conductive features formed over a surface of the second substrate facing the first substrate;
• a plurality of first electrical connections disposed between the first plurality of conductive features and the second plurality of conductive features;
• an encapsulant disposed over the surface of the second substrate facing the first substrate, the encapsulant encapsulating the second plurality of conductive features;
• and
• a first material disposed over the encapsulant, the first material surrounding each of the plurality of first electrical connections.

A semiconductor package comprising:

• a first substrate having a first plurality of electrical features extending from a surface thereof;
• a second substrate substrate having a second plurality of electrical features extending from a surface thereof, wherein the first plurality of electrical features is directed toward the second plurality of electrical features;
• a plurality of first electrical connections disposed between the first plurality of electrical features and the second plurality of electrical features;
• an encapsulant encapsulating the second plurality of electrical features and a first portion of each of the plurality of first electrical connections proximal the second substrate;
• a first material, comprising an electrically non-conductive material, disposed between the first substrate and the second substrate, the first material surrounding a second portion of each of the plurality of first electrical connections proximal the first substrate, wherein the first material is spaced apart from the first substrate, and wherein a width of the first material proximal the first substrate is smaller than a width of the first material proximal the second substrate.