Back to results
US 9,312,233 B2Granted
Method of forming molded panel embedded die structure
AssigneeIntel Corporation
InventorsRahul N. Manepalli, Hamid R. Azimi, John S. Guzek
Life of this patent
Estimating the term…
Abstract
Methods of forming molded panel coreless package structures are described. Those methods and structures may include fabrication of embedded die packages using large panel format and use of molding to improve rigidity of the panel, as well as to embed the die in a non-sacrificial mold material. The methods and structures described include methods for manufacturing thin, coreless substrate architectures which possess low warpage.
Claims28
A method of forming a packaging structure comprising:
- forming a first thin foil on a first side of a base foil and a second thin foil on a second side of the base foil;
- attaching at least one die directly on the first thin foil and attaching at least one die directly on the second thin foil;
- forming a molding material on the first thin foil and forming a molding material on the second thin foil, wherein the at least one die are embedded in the molding material;
- and
- forming at least one build up layer on the molding material disposed on the first thin foil and forming at least one build up layer on the molding material disposed on the second thin foils.
2 more elements
A method comprising:
- forming a first thin foil on a first side of a base foil and a second thin foil on a second side of the base foil;
- forming a first molding material directly on the first thin foil and forming a first molding material directly on the second thin foil, wherein the first molding material is non-sacrificial;
- and
- coupling at least one die to the first molding material.
1 more element
Dependencies are inferred from the claim text.