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US 9,312,228 B2Granted
Semiconductor device and method for manufacturing semiconductor device
AssigneeRohm Co., Ltd.
InventorsOsamu Miyata, Masaki Kasai, Shingo Higuchi
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Abstract
An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip. The sealing resin layer extends to a side surface of the passivation film to cover the side surface.
Claims15
A semiconductor device comprising:
- a semiconductor chip having a passivation film;
- a stress relieving layer provided on the passivation film;
- and
- a groove formed in a periphery of a surface of the semiconductor chip, the groove provided inside of an edge of the semiconductor chip, wherein
- the stress relieving layer is partly disposed in the groove.
2 more elements
Dependencies are inferred from the claim text.