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US 9,312,219 B2Granted
Interposer and packaging substrate having the interposer
OwnerDyi-Chung Huinventor
Life of this patent
Estimating the term…
Abstract
An interposer is provided, including a composite body and a plurality of conductive through vias penetrating the composite body. The composite body includes at least a main layer and at least a combining layer stacked on one another. The combining layer prevents the main layer from being cracked. The combining layer is more flexible than the main layer. The combining layer prevents the main layer from being cracked. Therefore, the main layer can be thinned on demands, and the interposer can be thinned accordingly.
Claims20
An interposer, comprising:
- a composite body comprising:
- a first main layer of a material selected from the group consisting of glass, silicon and ceramic, a second main layer of a material selected from the group consisting of glass, silicon and ceramic, and an adhesive layer disposed between the first main layer and the second main layer, wherein the adhesive layer is in direct surface contact with the first and second main layers and combines the first main layer to the second main layer;
- and a plurality of conductive through vias passing through the composite body, wherein a thickness of the adhesive layer is smaller than a thickness of each of the first and second main layers:
- the composite body has a first outermost layer that is a first dielectric layer, the first dielectric layer is disposed on the first main layer, and each of the conductive through vias has a straight sidewall that extends continuously, without interruption, through the first dielectric layer, the first main layer, the adhesive layer, and the second main layer;
- wherein a conductive material of each of the conductive through vias extends continuously, without interruption, through the first dielectric layer, the first main layer, the adhesive layer, and the second main layer;
- and wherein the first dielectric layer is in direct surface contact with the first main layer, is more flexible than the first and second main layers, and has a thickness greater than the thickness of the adhesive layer.
3 more elements
A packaging substrate, comprising:
- a carrying structure;
- and
- an interposer embedded in the carrying structure and comprising:
- a composite body comprising:
- a first main layer of a material selected from the group consisting of glass, silicon and ceramic,
- a second main layer of a material selected from the group consisting of glass, silicon and ceramic,
- a third main layer of a material selected from the group consisting of glass, silicon and ceramic,
- a first adhesive layer disposed between the first main layer and the second main layer, wherein the first adhesive layer is in direct surface contact with the first and second main layers and combines the first main layer to the second main layer,
- a second adhesive layer disposed between the second main layer and the third main layer, wherein the second adhesive layer is in direct surface contact with the second and third main layers and combines the second main layer to the third main layer,
- a first outermost layer that is a first dielectric layer, the first dielectric layer disposed on the first main layer,
- a second outermost layer that is a second dielectric layer, the second dielectric layer disposed on the third main layer;
- a plurality of conductive through vias passing through the composite body;
- a first redistribution layer disposed on top of the first dielectric layer and electrically connected to the conductive through vias;
- and
- a second redistribution layer disposed on bottom of the second dielectric layer and electrically connected to the conductive through vias,
- wherein a number of conductive layers in the second redistribution layer is greater than a number of conductive layers in the first redistribution layer.
13 more elements
A packaging substrate, comprising:
- a carrying structure;
- and
- an interposer embedded in the carrying structure and comprising:
- a composite body comprising:
- a first main layer of a material selected from the group consisting of glass, silicon and ceramic,
- a second main layer of a material selected from the group consisting of glass, silicon and ceramic,
- a third main layer of a material selected from the group consisting of glass, silicon and ceramic,
- a first adhesive layer disposed between the first main layer and the second main layer, wherein the first adhesive layer is in direct surface contact with the first and second main layers and combines the first main layer to the second main layer, and
- a second adhesive layer disposed between the second main layer and the third main layer, wherein the second adhesive layer is in direct surface contact with the second and third main layers and combines the second main layer to the third main layer;
- and
- a plurality of conductive through vias passing through the composite body,
- wherein
- a thickness of each of the first and second adhesive layers is smaller than a thickness of each of the first, second and third main layers,
- the composite body has a first outermost layer that is a first dielectric layer,
- the first dielectric layer is in direct surface contact with the first main layer, is more flexible than the first, second and third main layers, and has a thickness greater than the thickness of each of the first and second adhesive layers,
- a conductive material of each of the conductive through vias extends continuously, without interruption, through the first dielectric layer, the first main layer, the first adhesive layer, the second main layer, the second adhesive layer, and the third main layer,
- the composite body has a second outermost layer that is a second dielectric layer,
- the second dielectric layer is in direct surface contact with the third main layer, is more flexible than the first, second and third main layers, and has a thickness greater than the thickness of each of the first and second adhesive layers,
- the conductive material of each of the conductive through vias extends continuously, without interruption, through the first dielectric layer, the first main layer, the first adhesive layer, the second main layer, the second adhesive layer, the third main layer and the second dielectric layer, and
- the thickness of each of the first and second dielectric layers is less than 10 μm.
17 more elements
Dependencies are inferred from the claim text.