Semiconductor device with semiconductor chip and wiring layers

A semiconductor device comprising:

• a semiconductor chip that contains a surface where a plurality of electrode pads are formed, and a rear surface that is positioned on a side opposite the surface;
• and
• a wiring substrate that contains a chip mounting surface where the semiconductor chip is mounted, a mounting surface that is positioned on a side opposite the chip mounting surface, a plurality of first terminals that are mounted over the chip mounting surface and are electrically coupled to the electrode pads of the semiconductor chip, a plurality of second terminals that are mounted over the mounting surface, and a plurality of wiring layer that electrically couple the first terminals and the second terminals,
• wherein the wiring layers include a first wiring layer where a first wire is formed with a first wire and a second wire configuring a differential pair to which a differential signal is transmitted, and a second wiring layer that is mounted adjacent to an upper layer or a lower layer of the first wiring layer,
• the second wiring layer includes:
• a first conductor plate that contains a first aperture section formed at a position overlapped with a portion of the first wire in the thickness direction, and a second aperture section that is formed at a position overlapped with a portion of the second wire in the thickness direction;
• a first conductor pattern that is positioned within the first aperture section of the first conductor plate;
• and
• a second conductor pattern that is positioned within the second aperture section of the first conductor plate,
• the first aperture section and the second aperture section are each formed to pass through the first conductor plate in the thickness direction, and
• the first conductor pattern and the second conductor pattern respectively include a mesh pattern section coupled to the first conductor plate by a plurality of coupling sections.