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US 9,312,213 B2Granted
Bump structures having an extension
AssigneeSamsung Electronics Co., Ltd.
InventorsMoon Gi Cho, Young Lyong Kim, Sun-Hee Park, Hwan-Sik Lim
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Abstract
A bump structure may include a body portion spaced apart from a pad disposed on a substrate and a first extension extending from a side of the body portion onto the pad. A second extension extends from another side of the body portion.
Claims31
A bump structure comprising:
- a body portion provided on a substrate and spaced apart from a pad disposed on the substrate;
- a first extension extending in a first direction from the body portion toward the pad;
- and
- a second extension extending in a second direction from the body portion, the second direction opposite to or crossing the first direction,
- wherein a width of the first extension is smaller than a width of the body portion, wherein the bump structure includes a barrier layer, a metal layer, and a solder layer sequentially stacked on the substrate;
- and wherein a portion of the solder layer in the body portion is thicker than another portion of the solder layer in the first extension, wherein the first extension covers at least a portion of an upper surface of the pad, and wherein a thickness of the solder layer gradually increases from an end portion of the first extension provided on the pad toward the body portion.
3 more elements
A bump structure comprising:
- a body portion provided on a substrate and spaced apart from a pad disposed on the substrate;
- a first extension extending from a side of the body portion to the pad, the first extension vertically overlaps at least a portion of the pad;
- a second extension extending from the first extension;
- and
- wherein the body portion and the first extension include a barrier layer, a metal layer, and a solder layer which are sequentially stacked on the substrate;
- wherein a thickness of the metal layer is three or more times greater than a thickness of the barrier layer;
- and
- wherein a top surface of the body portion is higher than a top surface of the first extension;
- and
- wherein the first extension extends in a first direction, wherein the second extension extends from the first extension in a direction crossing the first direction.
7 more elements
An electrical connection structure comprising:
- first pads disposed on a first substrate;
- bump structures connected to the first pads;
- and
- second pads disposed on a second substrate, the second pads electrically connected to the first pads through the bump structures,
- wherein each of the bump structures comprises:
- a body portion laterally spaced apart from one of the first pads and connected to one of the second pads;
- a first extension extending in a first direction from the body portion to one of the first pads;
- and
- a second extension extending in a second direction from the body portion,
- wherein the body portion is thicker than the first extension,
- wherein the second extension includes:
- a first portion extending in a second direction opposite to the first direction;
- and
- second portion extending in a third direction crossing the first and second directions.
11 more elements
Dependencies are inferred from the claim text.