Method for housing an electronic component in a device package and an electronic component housed in the device package

An electronic device package comprising:

• a first substrate comprising a component area on a first main surface;
• an electronic component disposed on the component area of the first main surface;
• first contact pads disposed on the first main surface and outside of the component area, the first contact pads being electronically coupled to the electronic component;
• a second substrate comprising second contact pads disposed on a first main surface of the second substrate;
• a first open-top frame structure disposed between the first main surface of the first substrate and the first main surface of the second substrate;
• and
• a cavity disposed between the electronic component and the first main surface of the second substrate, the cavity being at least partially surrounded by the first open-top frame structure,
• wherein the first contact pads on the first main surface of the first substrate are electrically and mechanically connected by a solder material with the second contact pads on the first main surface of the second substrate.

An electronic device package comprising:

• a first substrate comprising first contact pads and a component area on a first main surface;
• an electronic component disposed over the component area of the first main surface;
• a second substrate comprising second contact pads disposed on a first main surface of the second substrate, the first main surface of the first substrate facing the first main surface of the second substrate;
• a first open-top frame structure disposed between the first substrate and the second substrate;
• and
• a cavity at least partially surrounded by the first open-top frame structure,
• wherein the first contact pads on the first main surface of the first substrate are electrically and mechanically connected by a solder material with the second contact pads on the first main surface of the second substrate.