Semiconductor device and manufacturing method thereof

A semiconductor device comprising:

• a plurality of power units configured to be placed in parallel in a predetermined direction, and integrally sealed with resin, wherein each of the power units includes a plurality of semiconductor elements placed on a metal plate having predetermined gaps with each other,
• wherein two of the power units placed adjacent to each other in the predetermined direction have a passage therebetween through which the resin flows injected during manufacturing,
• wherein a structure is placed on the passage so that an end part of the structure on a side of the inlet is positioned in a positional range corresponding to the predetermined gap,
• wherein the structure is a joint to connect the two power units placed adjacent to each other in the predetermined direction, and to be integrally sealed with the resin, along with the power unit.

A semiconductor device comprising:

• a plurality of power units configured to be placed in parallel in a predetermined direction, and integrally sealed with resin, wherein each of the power units includes a plurality of semiconductor elements placed on a metal plate having predetermined gaps with each other,
• wherein two of the power units placed adjacent to each other in the predetermined direction have a passage therebetween through which the resin flows injected during manufacturing,
• wherein the semiconductor elements of each of the two power units include a near-sided semiconductor element that is closer to an inlet of the resin among the two semiconductor elements having the predetermined gap therebetween,
• wherein a structure is positioned on a passage and downstream in a resin flow direction relative to a predetermined position that corresponds to end parts of the near-sided semiconductor elements such that the structure prevents the resin from flowing downstream in a resin flow direction, the end parts being on a side opposite to another side closer to the inlet,
• wherein the structure is a far-sided semiconductor element positioned on a far side from the inlet, disposed to project in the predetermined direction from the end part of the near-sided semiconductor element in the predetermined direction.

A manufacturing method of a semiconductor device including a plurality of power units configured to be placed in parallel in a predetermined direction, and integrally sealed with resin, wherein each of the power units includes a plurality of semiconductor elements placed on a metal plate having predetermined gaps with each other,

• wherein two of the power units placed adjacent to each other in the predetermined direction have a passage therebetween through which the resin flows injected during manufacturing,
• wherein the semiconductor elements of each of the two power units include a near-sided semiconductor element that is closer to an inlet of the resin among the two semiconductor elements having the predetermined gap therebetween,
• the method comprising:
• placing a joint as a structure on the passage to prevent the resin from flowing downstream in a resin flowing direction, wherein the structure is positioned downstream in the resin flowing direction relative to a predetermined position corresponding to an end part on a side opposite to another side closer to the inlet of the near-sided semiconductor element, wherein the joint is to connect the two power units placed adjacent to each other in the predetermined direction, and to be integrally sealed with the resin, along with the power unit;
• and
• injecting the resin.

A manufacturing method of a semiconductor device including a plurality of power units configured to be placed in parallel in a predetermined direction, and integrally sealed with resin, wherein each of the power units includes a plurality of semiconductor elements placed on a metal plate having predetermined gaps with each other,

• wherein two of the power units placed adjacent to each other in the predetermined direction have a passage therebetween through which the resin flows injected during manufacturing,
• the method comprising:
• placing a joint on the passage so that an end part on a side of the inlet of the structure is positioned in a positional range corresponding to the predetermined gap, wherein the joint is to connect the two power units placed adjacent to each other in the predetermined direction, and to be integrally sealed with the resin, along with the power unit;
• and
• injecting the resin.