Semiconductor device
AssigneePS4 Luxco S.a.r.l.
InventorsKayoko Shibata, Hitoshi Miwa, Yoshihiko Inoue
Life of this patent
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Abstract
A method for bypassing a defective through silicon via x in a group of n adjacent through silicon vias, includes receiving a plurality of relief signals to identify the defective through silicon via x, activating x−1 switch circuits to connect x−1 data circuits to through silicon vias 1 to x−1 in the group of n adjacent through silicon vias, activating n−x switch circuits to connect n−x data circuits to through silicon vias x+1 to n in the group of n adjacent through silicon vias, and activating a switch circuit to connect a data circuit to an auxiliary through silicon via which is adjacent through silicon via n in the group of n adjacent through silicon vias.
Claims13
A semiconductor device comprising:
- a plurality of n data circuits;
- a plurality of n adjacent through silicon vias;
- an auxiliary through silicon via;
- a relief information circuit configured to provide a plurality of relief signals to identify a defective through silicon via x in the plurality of n through silicon vias, wherein x is an integer greater than 1 and n is an integer greater than x;
- and
- a plurality of n switch circuits, the plurality of n switch circuits being configured so that x−1 switch circuits of the n switch circuits are activated based on the relief signals to connect x−1 data circuits to through silicon vias 1 to x−1 in the plurality of n adjacent through silicon vias, n−x switch circuits of the n switch circuits are activated based on the relief signals to connect n−x data circuits to through silicon vias x+1 to n in the plurality of n adjacent through silicon vias, and a switch circuit of the n switch circuits is activated based on the relief signals to connect a data circuit to the auxiliary through silicon via;
- wherein each of the n switch circuits is configured to receive a data signal from a corresponding one of the n data circuits and to output the data signal to one of two through silicon vias of the n adjacent through silicon vias and the auxiliary through silicon via depending on the relief signals.
Dependencies are inferred from the claim text.