Solid structures for thermal management

A solid structure for thermal management, comprising:

• a metallic composite member comprising a spreader plate and having a first thermal conductivity, wherein the metallic composite member is assembled to be in thermal contact with a heat source, and wherein the metallic composite member has a planar surface extending entirely from a first edge of the metallic composite member to a second edge, opposite the first edge, of the metallic composite member, the planar surface further extending entirely from a third edge of the metallic composite member to a fourth edge, opposite the third edge, of the metallic ceramic composite member, and further wherein the metallic composite member comprises a metal-ceramic matrix mechanically coupled to a housing of an electronic assembly containing the heat source;
• and
• an oxide member having a second thermal conductivity and assembled to form an oxide-composite interface with the metallic composite member at the planar surface,
• the first thermal conductivity is greater than the second thermal conductivity, whereby the solid structure transports heat from the heat source substantially along the oxide-composite interface.

A method of thermal management, comprising:

• providing a metallic composite member comprising a spreader plate and having a first thermal conductivity, wherein the metallic composite member has a planar surface extending entirely from a first edge of the metallic composite member to a second edge, opposite the first edge, of the metallic composite member, the planar surface further extending entirely from a third edge of the metallic composite member to a fourth edge, opposite the third edge, of the metallic composite member;
• assembling the metallic composite member to be in thermal contact with a heat source within an electronic assembly, wherein the assembling comprises mechanically coupling the metallic composite member to a housing of the electronic assembly;
• and
• covering at least a portion of the planar surface of the metallic composite member with an oxide layer having a second thermal conductivity, the covering comprising forming an oxide-composite interface between the oxide layer and the metallic composite member at the planar surface, wherein the first thermal conductivity is greater than the second thermal conductivity.