Integrated circuit packaging system with terminals and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsByung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua
Life of this patent
Estimating the term…
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a mounting platform; applying an attach layer on the mounting platform; mounting an integrated circuit die on the attach layer; forming an encapsulation on the integrated circuit die and the attach layer, the mounting platform exposed from the encapsulation; and forming a terminal having a terminal protrusion from the leadframe, the terminal protrusion below a horizontal plane of the mounting platform.
Claims8
A method of manufacture of an integrated circuit packaging system comprising:
- providing a leadframe, of a first metal, having a leadframe platform region;
- forming a mounting platform on the leadframe platform region by depositing the mounting platform, of a second metal, on the leadframe platform region;
- applying an attach layer directly on the mounting platform;
- mounting an integrated circuit die on the attach layer, the attach layer completely covering a non-active side of the integrated circuit die;
- forming an encapsulation on the integrated circuit die and the attach layer;
- etching the leadframe platform region, to completely remove the first metal, for exposing an entire area of the second metal as a platform bottom side of the mounting platform from the encapsulation and for forming an encapsulation cavity at an encapsulation bottom surface of the encapsulation;
- and
- forming a terminal having a terminal protrusion from the leadframe, the terminal protrusion below the platform bottom side of the mounting platform and the encapsulation separating the terminal from contact with the mounting platform;
- wherein the first metal is different from the second metal.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a leadframe, of a first metal, having a leadframe platform region;
- forming a mounting platform on the leadframe platform region by depositing the mountings platform, of a second metal, on the leadframe platform region;
- applying an attach layer directly on the mounting platform;
- mounting an integrated circuit die on the attach layer, the attach layer completely covering a non-active side of the integrated circuit die;
- forming an encapsulation on the integrated circuit die and the attach layer;
- etching the leadframe platform region, to completely remove the first metal, for exposing an entire area of the second metal as a platform bottom side of the mounting platform from the encapsulation and for forming an encapsulation cavity at an encapsulation bottom surface, the encapsulation cavity shaped by the leadframe platform region;
- and
- removing portions of the leadframe for forming a terminal having a terminal protrusion, the terminal protrusion extends below the platform bottom side of the mounting platform and the encapsulation separating the terminal from contact with the mounting platform;
- wherein the first metal is different from the second metal.
Dependencies are inferred from the claim text.