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US 9,312,193 B2Granted
Stress relief structures in package assemblies
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorHsien-Wei Chen
Life of this patent
Estimating the term…
Abstract
A semiconductor package structure, comprises a substrate, a die region having one or more dies disposed on the substrate, and at least one stress relief structure disposed at one or more corners of the substrate, the at least one stress relief structure being adjacent to at least one die of the one or more dies.
Claims19
A semiconductor package structure, comprising:
- a substrate;
- a solder region;
- one or more dies bonded on the substrate through the solder region;
- and
- two or more stress relief structures, each stress relief structure of the stress relief structures being formed on or bonded onto a surface of the substrate and being disposed adjacent to at least one die of the one or more dies, wherein a first stress relief structure of the two or more stress relief structures has a different shape from a second stress relief structure of the two or more stress relief structures,
- wherein
- upper surfaces of the stress relief structures are unconnected;
- and
- at least one stress relief structure of the two or more stress relief structures is disposed adjacent to a corner of the at least one die, and the at least one stress relief structure comprises:
- a first portion extending along a first side of the at least one die, the first side being associated with the corner of the at least one die;
- and
- a second portion extending along a second side of the at least one die, the second side being associated with the corner of the at least one die,
- wherein the two or more stress relief structures individually comprise a material selected from the group consisting of a thermally conductive material, metal, tungsten, aluminum, aluminum alloy, polysilicon, silicide, tantalum, refractory metal, copper, copper alloy, gold, gold alloy, TaN, titanium, TiN, nickel, and combinations thereof.
10 more elements
A semiconductor package structure, comprising:
- a substrate;
- a solder region;
- a plurality of dies, with at least one die of the plurality of dies being larger than the other dies of the plurality of dies, the plurality of dies being bonded on the substrate through the solder region;
- an underfill between each die of the plurality of dies and the substrate;
- and
- two or more stress relief structures, each stress relief structure of the stress relief structures being formed on or bonded onto a surface of the substrate and being disposed adjacent to the at least one die of the plurality of dies, wherein at least a first stress relief structure of the two or more stress relief structures are spaced from each die of the plurality of dies in a direction parallel to a top surface of the substrate, and a second stress relief structure of the two or more stress relief structures is spaced from the underfill,
- wherein
- upper surfaces of the stress relief structures are unconnected;
- and
- at least one stress relief structure of the two or more stress relief structures is disposed adjacent to a corner of the at least one die, and the at least one stress relief structure comprises:
- a first portion extending along a first side of the at least one die, the first side being associated with the corner of the at least one die;
- and
- a second portion extending along a second side of the at least one die, the second side being associated with the corner of the at least one die.
10 more elements
A semiconductor package structure, comprising:
- a substrate;
- a solder region;
- one or more dies bonded on the substrate through the solder region;
- an underfill between each die of the one or more dies and the substrate;
- and
- two or more stress relief structures, each stress relief structure of the stress relief structures being formed on or bonded onto a surface of the substrate and being disposed adjacent to at least an identified largest die of the one or more dies, wherein at least a first stress relief structure of the two or more stress relief structures is spaced from each die of the one or more dies in a direction parallel to a top surface of the substrate, and at least a second stress relief structure of the two or more stress relief structures spaced from the underfill,
- wherein
- upper surfaces of the stress relief structures are unconnected;
- and
- at least one stress relief structure of the two or more stress relief structures is disposed adjacent to a corner of the identified largest die, and the at least one stress relief structure comprises:
- a first portion extending along a first side of the identified largest die, the first side being associated with the corner of the identified largest die;
- and
- a second portion extending along a second side of the identified largest die, the second side being associated with the corner of the identified largest die.
10 more elements
Dependencies are inferred from the claim text.